Supermicro Rack Servers (verschillende types)

3x Supermicro Server met zelfde specificaties (Ingebruikname  midden 2017):

Supermicro X10DRW-NT

32 x Intel(R) Xeon(R) CPU E5-2620 v4 (LGA 2011) @ 2.10GHz (2 Sockets in gebruik)
256GB Intern Geheugen
2x 240GB Samsung Enterprise SSD's Specificaties: - Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-          2600 v4†/ v3 family; QPI up to 9.6GT/s
- Intel® C612 chipset
- Up to 2TB† ECC 3DS LRDIMM , up to
  DDR4- 2400†MHz; 16 DIMM slots
- Riser card support:
- Left side - 1 PCI-E 3.0 x32
- Intel® X540 Dual port 10GBase-T
- 10 SATA3 (6Gbps); RAID 0, 1, 5, 10
- Integrated IPMI 2.0 and KVM with Dedicated LAN
- 2 USB 3.0 ports (via header)
- 4 USB 2.0 ports (rear)
- 2 PCI-E 3.0 NVMExpress x4 ports
- VGA port

1x Supermicro Server (Ingebruikname eind 2018):

Supermicro X11DDW-NT

32 x Intel(R) Xeon(R) Silver 4110 CPU @ 2.10GHz (2 Sockets in gebruik)
376GB intern Geheugen2x 240GB Samsung Enterprise SSD's

Specificaties: - 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon®                Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to    205W TDP, 2 UPI up to 10.4 GT/s
- Intel® C622
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC          LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode      (Cascade Lake only).
- 1 PCIe 3.0 x32 Left Riser Slot,
- 1 PCIe 3.0 x16 Right Riser Slot,
- 1 PCIe 3.0 x16 for Add-On-Module (AOM)
- M.2 Interface: PCIe 3.0 x4
- M.2 Form Factor: 2242, 2260, 2280, 22110
- M.2 Key: M-Key
- U.2 Interface: PCIe 3.0 x4,
- 4 PCIe 3.0 NVMe x4 Internal Port(s)
- Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10Gbase-T
- from C622
- VGA port

1x Supermicro Server (Ingebruikname eind 2020):

Supermicro X11DDW-NT

64 x Intel(R) Xeon(R) Gold 6226R CPU @ 2.90GHz (2 Sockets in gebruik)
376GB Intern Geheugen
2x 240GB Samsung Enterprise SSD's

Specificaties:
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
- Intel® C622
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
- 1 PCIe 3.0 x32 Left Riser Slot,
- 1 PCIe 3.0 x16 Right Riser Slot,
- 1 PCIe 3.0 x16 for Add-On-Module (AOM)
- M.2 Interface: PCIe 3.0 x4
- M.2 Form Factor: 2242, 2260, 2280, 22110
- M.2 Key: M-Key
- U.2 Interface: PCIe 3.0 x4,
- 4 PCIe 3.0 NVMe x4 Internal Port(s)
- Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10Gbase-T
- from C622
- VGA port

Prijs overeen te komen.  Kan ook aangekocht worden met verschillende Enterprise SSD configuraties. Zie ander zoekertje mbt de beschikbare SSD configuraties.